Apr 072012

This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a higher pressure, 25 kPa, deterioration is slower, and the effective life of pads and MRR is enhanced.

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  1. A.Q. Biddut, L.C. Zhang, Y.M. Ali, Effect of polishing time and pressure on polishing pad performance, KEY ENG MATER 389-390 (2009) 510.

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